规格
- 安装类型 Panel Mount
- Contact Material Beryllium Copper
- 工作温度 -65°C ~ 150°C
- 职位数量 30
- 接触完成 Gold
- Contact Finish Thickness 30.0µin (0.76µm)
- 筑屋材料 Polyphenylene Sulfide (PPS)
- Current Rating (Per Contact) 3 A
- Card Thickness 0.062" (1.57mm)
- 适配器类型 Card Slot to Card Slot
- Flange Feature Top Opening, Unthreaded, 0.125" (3.18mm) Dia